Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. - Dau Fatt Lim; Shiv Govind Singh; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan (3DIC, 2009)

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. - Lan Peng; Hongyu Li; Dau Fatt Lim; Riko I. Made; Guo-Qiang Lo; Dim-Lee Kwong; Chuan Seng Tan (3DIC, 2010)

Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. - Dau Fatt Lim; K. C. Leong; Chuan Seng Tan (3DIC, 2011)

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. - Chuan Seng Tan; Dau Fatt Lim; Xiao Fang Ang; Jun Wei; K. C. Leong (Microelectron. Reliab., 2012)