A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectrics. - Fen Chen; Rolf-Peter Vollertsen; Baozhen Li; Dave Harmon; Wing L. Lai (Microelectron. Reliab., 2002)

Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. - Fen Chen; J. Gill; Dave Harmon; T. Sullivan; A. Strong; B. Li; H. Rathore; Daniel C. Edelstein (Microelectron. Reliab., 2006)

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies. - Fen Chen; O. Bravo; Dave Harmon; Michael A. Shinosky; J. Aitken (Microelectron. Reliab., 2008)