Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. - Yibo Chen; Eren Kursun; Dave Motschman; Charles Johnson; Yuan Xie 001 (ISLPED, 2011)

Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits. - Yibo Chen; Eren Kursun; Dave Motschman; Charles Johnson; Yuan Xie 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013)