Stacked solder bumping technology for improved solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2001)

Effect of substrate flexibility on solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2002)