Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation. - David Dalleau; Kirsten Weide-Zaage (Microelectron. Reliab., 2001)

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. - David Dalleau; Kirsten Weide-Zaage; Yves Danto (Microelectron. Reliab., 2003)

Dynamic void formation in a DD-copper-structure with different metallization geometry. - Kirsten Weide-Zaage; David Dalleau; Yves Danto; Hélène Frémont (Microelectron. Reliab., 2007)