3D Printing for the Rapid Prototyping of Structural Electronics. - Eric W. MacDonald; Rudy Salas; David Espalin; Mireya Perez; Efrain Aguilera; Dan Muse; Ryan B. Wicker (IEEE Access, 2014)

A study to detect a material deposition status in fused deposition modeling technology. - Chiyen Kim; David Espalin; Alejandro Cuaron; Mireya A. Perez; Eric W. MacDonald; Ryan B. Wicker (AIM, 2015)

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. - Chiyen Kim; David Espalin; Min Liang; Hao Xin; Alejandro Cuaron; Issac Varela; Eric W. MacDonald; Ryan B. Wicker (IEEE Access, 2017)

Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing. - Callum Bailey; Efrain Aguilera; David Espalin; Jose Motta; Alfonso Fernández; Mireya A. Perez; Christopher Dibiasio; Dariusz Pryputniewicz; Eric W. MacDonald; Ryan B. Wicker (IEEE Access, 2018)

Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts With Embedded Wires for High Current-Carrying Applications. - Kazi Md Masum Billah; Jose L. Coronel; Michael C. Halbig; Ryan B. Wicker; David Espalin (IEEE Access, 2019)

Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor. - Cory Marquez; Jesus J. Mata; Anabel Renteria; Diego González; Sofia Gabriela Gomez; Alexis Lopez; Annette N. Baca; Alan Nuñez; Md Sahid Hassan; Vincent Burke; Dina Perlasca; Yifeng Wang; et al. (Sensors, 2023)