Effects of mechanical stress and moisture on packaging interfaces. - Stephen L. Buchwalter; Peter J. Brofman; Claudius Feger; Michael A. Gaynes; Kang-Wook Lee 003; Luis J. Matienzo; David L. Questad (IBM J. Res. Dev., 2005)

Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy. - Lorenzo Valdevit; V. Khanna; Arun Sharma; Sri M. Sri-Jayantha; David L. Questad; K. Sikka (Microelectron. Reliab., 2008)