Power grid redundant path contribution in system on chip (SoC) robustness against electromigration. - Boukary Ouattara; Lise Doyen; David Ney; Habib Mehrez; Pirouz Bazargan-Sabet (Microelectron. Reliab., 2014)

Interconnect design study for electromigration reliability improvement. - Giulio Marti; Lucile Arnaud; David Ney; Yves Wouters (IRPS, 2015)

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration. - Claire Fenouillet-Béranger; S. Beaurepaire; Fabien Deprat; Alexandre Ayres De Sousa; Laurent Brunet; Perrine Batude; Olivier Rozeau; François Andrieu; Paul Besombes; M.-P. Samson; Bernard Previtali; F. Nemouchi; et al. (ESSDERC, 2017)

Hot-Carrier induced Breakdown events from Off to On mode in NEDMOS. - Alain Bravaix; Edith Kussener; David Ney; Xavier Federspiel; Florian Cacho (IRPS, 2020)