Converting an Undergrad-Lab to an Interactive E-Learning Experience That Enables Student Teamwork. - Ferdinand Keil; David Riehl; Klaus Hofmann (FIE, 2021)

Multi-axis Force Sensor for Sensor-integrating Bolts. - Felix Herbst; Romol Chadda; Claas Hartmann; Julian Peters; David Riehl; Thomas Gwosch; Klaus Hofmann; Sven Matthiesen; Mario Kupnik (IEEE SENSORS, 2022)

Quick Compact Model Development Through Slow Transient Simulation: An Alternative Approach to Table Models for Emerging Nanodevices. - Maximilian Reuter; Dakyung Lee; David Riehl; Klaus Hofmann (NEWCAS, 2022)

From breadboard to complex electronic systems - introducing a heterogenous group of undergrad students to design and analysis of electronic circuits. - David Riehl; Ferdinand Keil; Klaus Hofmann (FIE, 2023)

WIP: Building an Education Ecosystem for Next Generation Microelectronics Experts in Green and Circular Economy with Digitally-Supported Teaching Methods for Sustainable Chips and Applications (EU Project GreenChips-EDU). - Klaus Hofmann; Ferdinand Keil; David Riehl; Alicja Michalowska-Forsyth; Nikolaus Czepl; Sarah Woywod; Dominik Zupan; Mario R. Casu; Carlo Ricciardi; Massimo Violante; Mariagrazia Graziano; Yuri Ardesi; et al. (FIE, 2024)

WIP: Teaching Advanced PCB Design in a Collaborative, Project-Based Learning Approach. - Sebastian Zisch; David Riehl; Klaus Hofmann; Ferdinand Keil (FIE, 2024)

Comparison of Optical and Capacitive Dew Point Detection Using COTS Components. - Malte Nilges; David Riehl; Klaus Hofmann; Ferdinand Keil (IEEE SENSORS, 2024)

Overcoming Conflicts of Objectives Between Sensory and Mechanical Domain in the Development of Sensor-Integrating Machine Elements Using the Example of Bolts. - Julian Peters; Nathanael Mirbach; Felix Herbst; David Riehl; Mario Kupnik; Klaus Hofmann; Sven Matthiesen (IEEE Access, 2024)

Flexible Ultra-Low Power Strain Gauge Readout Platform for Sensor-Integrating Bolts. - David Riehl; Felix Herbst; Julian Peters; Dirk Leiacker; Sven Matthiesen; Mario Kupnik; Klaus Hofmann (I2MTC, 2025)