A thermo-mechanical study on the electrical resistance of aluminum wire conductors. - De-Shin Liu; Chin-Yu Ni (Microelectron. Reliab., 2002)

The optimization design of bump interconnections in flip chip packages from the electrical standpoint. - De-Shin Liu; Chin-Yu Ni (Microelectron. Reliab., 2002)

Procedure for design optimization of a T-cap flip chip package. - Chin-Yu Ni; De-Shin Liu; Ching-Yang Chen (Microelectron. Reliab., 2002)

Design of a novel chip on glass package solution for CMOS image sensor device. - Ching-Yang Chen; Yung-Ching Chao; De-Shin Liu; Zhen-Wei Zhuang (Microelectron. Reliab., 2006)

Novel analysis model for investigation of contact force and scrub length for design of probe card. - De-Shin Liu; Chi-Min Chang; John Liu; Shu-Ching Ho; Hao-Yin Tsai (Microelectron. Reliab., 2010)

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method. - De-Shin Liu; Zhen-Wei Zhuang; Ching-Yang Chen; Cho-Liang Chung (Microelectron. Reliab., 2010)

Bifurcation Analysis of Gear Pair with Continuous and Intermittent Mesh Stiffness Using Enhanced Compliance Method. - De-Shin Liu; Chuen-Ren Wang; Ting-Nung Shiau; Kuo-Hsuan Huang; Wei-Chun Hsu (Int. J. Bifurc. Chaos, 2020)