Fabrication of TSV-based silicon interposers. - Dean Malta; Erik Vick; Scott H. Goodwin; Christopher Gregory; Matthew Lueck; Alan Huffman; Dorota Temple (3DIC, 2010)

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch. - Matthew Lueck; Chris W. Gregory; Dean Malta; Alan Huffman; John M. Lannon; Dorota Temple (3DIC, 2013)

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test. - Dorota S. Temple; Dean Malta; Erik P. Vick; Matthew R. Lueck; Scott H. Goodwin; Mark S. Muzilla; Christopher M. Masterjohn; Mark R. Skokan (3DIC, 2014)