6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. - Christophe Erdmann; Donnacha Lowney; Adrian Lynam; Aidan Keady; John McGrath; Edward Cullen; Daire Breathnach; Denis Keane; Patrick Lynch; Marites De La Torre; Ronnie De La Torre; Peng Lim; et al. (ISSCC, 2014)

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters. - Christophe Erdmann; Donnacha Lowney; Adrian Lynam; Aidan Keady; John McGrath; Edward Cullen; Daire Breathnach; Denis Keane; Patrick Lynch; Marites De La Torre; Ronnie De La Torre; Peng Lim; et al. (IEEE J. Solid State Circuits, 2015)