Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits. - Dennis Rich; Anna Kasperovich; Mohamadali Malakoutian; Robert M. Radway; Shiho Hagiwara; Takahide Yoshikawa; Srabanti Chowdhury; Subhasish Mitra (DAC, 2023)

Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits. - Tathagata Srimani; Robert M. Radway; Jinwoo Kim; Kartik Prabhu; Dennis Rich; Carlo Gilardi; Priyanka Raina; Max M. Shulaker; Sung Kyu Lim; Subhasish Mitra (DATE, 2023)

EMBER: A 100 MHz, 0.86 mm2, Multiple-Bits-per-Cell RRAM Macro in 40 nm CMOS with Compact Peripherals and 1.0 pJ/bit Read Circuitry. - Luke R. Upton; Akash Levy; Michael D. Scott 002; Dennis Rich; Win-San Khwa; Yu-Der Chih; Meng-Fan Chang; Subhasish Mitra; Priyanka Raina; Boris Murmann (ESSCIRC, 2023)

Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices. - Luke R. Upton; Guénolé Lallement; Michael D. Scott 002; Joyce Taylor; Robert M. Radway; Dennis Rich; Mark Nelson; Subhasish Mitra; Boris Murmann (ISQED, 2023)

Foundry Monolithic 3D BEOL Transistor + Memory Stack: Iso-performance and Iso-footprint BEOL Carbon Nanotube FET+RRAM vs. FEOL Silicon FET+RRAM. - Tathagata Srimani; Andrew C. Yu; Robert M. Radway; Dennis Rich; Mark Nelson; Simon S. Wong; Denis Murphy; Samuel Fuller; Gage Hills; Subhasish Mitra; Max M. Shulaker (VLSI Technology and Circuits, 2023)

Efficient Ultra-Dense 3D IC Power Delivery and Cooling Using 3D Thermal Scaffolding. - Dennis Rich; Tathagata Srimani; Mohamadali Malakoutian; Srabanti Chowdhury; Subhasish Mitra (ICCAD, 2024)

EMBER: Efficient Multiple-Bits-Per-Cell Embedded RRAM Macro for High-Density Digital Storage. - Akash Levy; Luke R. Upton; Michael D. Scott 002; Dennis Rich; Win-San Khwa; Yu-Der Chih; Meng-Fan Chang; Subhasish Mitra; Boris Murmann; Priyanka Raina (IEEE J. Solid State Circuits, 2024)