Deok-Hoon Kim

According to our database1, Deok-Hoon Kim authored at least 2 papers between 2002 and 2003.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

Timeline

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Links

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Bibliography

2003
Wafer level packaging having bump-on-polymer structure.
Microelectron. Reliab., 2003

2002
Solder joint reliability of a polymer reinforced wafer level package.
Microelectron. Reliab., 2002


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