Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module. - Michael J. Ellsworth Jr.; Roger R. Schmidt; Dereje Agonafer (IBM J. Res. Dev., 2002)

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. - Leon Xu; Tommi Reinikainen; Wei Ren; Bo Ping Wang; Zhenxue Han; Dereje Agonafer (Microelectron. Reliab., 2004)