Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads. - Prachi Shukla; Derrick Aguren; Tom Burd; Ayse K. Coskun; John Kalamatianos (DATE, 2023)

A Research Retrospective on AMD's Exascale Computing Journey. - Gabriel H. Loh; Michael J. Schulte; Mike Ignatowski; Vignesh Adhinarayanan; Shaizeen Aga; Derrick Aguren; Varun Agrawal; Ashwin M. Aji; Johnathan Alsop; Paul T. Bauman; Bradford M. Beckmann; Majed Valad Beigi; et al. (ISCA, 2023)

Folded Banks: 3D-Stacked HBM Design for Fine-Grained Random-Access Bandwidth. - Vignesh Adhinarayanan; Bradford M. Beckmann; Wantong Li; Mohammad Seyedzadeh; Sergey Blagodurov; Derrick Aguren; Hayden Hyungdong Lee (ISCA, 2025)