Transient-induced latch-up test setup for wafer-level and package-level. - Detlef Bonfert; Horst A. Gieser; Heinrich Wolf; M. Frank; A. Konrad; J. Schulz (Microelectron. Reliab., 2006)

ESD Susceptibility of Submicron Air Gaps. - Heinrich Wolf; Horst A. Gieser; Detlef Bonfert; Markus Hauser (Microelectron. Reliab., 2006)

A novel micropump driver used in environmental sensor applications. - Bernadette Kinzel; Detlef Bonfert; Florian Lippert; Frank Vanselow; Erkan Isa; Doris Schmitt-Landsiedel; Linus Maurer (IEEE SENSORS, 2016)