3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. - Stuart Daudlin; Anthony Rizzo; Nathan C. Abrams; Sunwoo Lee 002; Devesh Khilwani; Vaishnavi Murthy; James Robinson; Terence Collier; Alyosha C. Molnar; Keren Bergman (OFC, 2021)

3D-Integrated, Low Power, High Bandwidth Density Opto-Electronic Transceiver. - Devesh Khilwani; Sunwoo Lee 002; Christine Ou; Stuart Daudlin; Anthony Rizzo; Songli Wang; Michael Cullen; Keren Bergman; Alyosha C. Molnar (ISCAS, 2024)

Scaling Co-Packaged Optical Interconnects Using Hybrid 2.5D/3D Integration. - Austin Rovinski; Yanghui Ou; Christine Ou; Devesh Khilwani; Yuyang Wang 003; Songli Wang; Sunwoo Lee 002; Keren Bergman; Alyosha C. Molnar; Christopher Batten (ISCAS, 2025)