Non-uniform strain in lattice-mismatched heterostructure tunnel field-effect transistors. - Devin Verreck; Anne S. Verhulst; Bart Soree; Nadine Collaert; Anda Mocuta; Aaron Thean; Guido Groeseneken (ESSDERC, 2016)

Beyond-Si materials and devices for more Moore and more than Moore applications. - Nadine Collaert; AliReza Alian; Hiroaki Arimura; Geert Boccardi; Geert Eneman; Jacopo Franco; Tsvetan Ivanov; Dennis Lin; Jérôme Mitard; S. Ramesh; R. Rooyackers; Marc Schaekers; et al. (ICICDT, 2016)

Impact of Mechanical Stress on the Electrical Performance of 3D NAND. - Anastasiia Kruv; Antonio Arreghini; Mario Gonzalez; Devin Verreck; Geert Van den Bosch; Ingrid De Wolf; Arnaud Furnémont (IRPS, 2019)

A TCAD Compatible SONOS Trapping Layer Model for Accurate Programming Dynamics. - Franz Schanovsky; Devin Verreck; Antonio Arreghini; Gerhard Rzepa; Zlatan Stanojevic; Christian Kernstock; Oskar Baumgartner; Maarten Rosmeulen; Markus Karner (IMW, 2021)

Analysis of BTI in 300 mm integrated dual-gate WS2 FETs. - L. Panarella; Quentin Smets; Devin Verreck; Tom Schram; Daire Cott; I. Asselberghs; Ben Kaczer (DRC, 2022)

At the Extreme of 3D-NAND Scaling: 25 nm Z-Pitch with 10 nm Word Line Cells. - S. Rachidi; Antonio Arreghini; Devin Verreck; G. L. Donadio; K. Banerjee; K. Katcko; Yusuke Oniki; Geert Van den Bosch; Maarten Rosmeulen (IMW, 2022)

Liquid Memory and the Future of Data Storage. - Maarten Rosmeulen; Cesar J. Lockhart de la Rosa; K. Willems; S. Fransen; B.-Y. Shih; Devin Verreck; V. Kalangi; F. Yasin; Harold Philipsen; Y. T. Set; N. Ronchi; W. Van Roy; et al. (IMW, 2022)

Enabling 3D NAND Trench Cells for Scaled Flash Memories. - S. Rachidi; S. Ramesh; Laurent Breuil; Z. Tao; Devin Verreck; G. L. Donadio; Antonio Arreghini; Geert Van den Bosch; Maarten Rosmeulen (IMW, 2023)

Impact of gate stack processing on the hysteresis of 300 mm integrated WS2 FETs. - L. Panarella; Ben Kaczer; Quentin Smets; Devin Verreck; Tom Schram; Daire Cott; Dennis Lin; Stanislav Tyaginov; I. Asselberghs; Cesar J. Lockhart de la Rosa; Gouri Sankar Kar; Valeri Afanas'ev (IRPS, 2023)

The Promise of 2-D Materials for Scaled Digital and Analog Applications. - Devin Verreck; Piet Wambacq; Maarten Van De Put; Zubair Ahmed; Quentin Smets; Aryan Afzalian; Rutger Duflou; Xiangyu Wu; Gioele Mirabelli; Rongmei Chen; Inge Asselberghs; Gouri Sankar Kar (ISSCC, 2023)

Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling. - S. Rachidi; S. Ramesh; Devin Verreck; J. Loyo; Y. Jeong; H. Puliyalil; Jie Li; F. Seidel; Geert Van Den Bosch; Maarten Rosmeulen (IMW, 2025)

Advanced RTN Analysis on 3D NAND Trench Devices Using Physics-Informed Machine Learning Framework. - Yusuke Higashi; Anirudh Varanasi; Philippe J. Roussel; Pablo Saraza-Canflanca; J. P. Bastos; Alexander Grill; E. Catapano; R. Asanovski; Jacopo Franco; Ben Kaczer; Adrian Chasin; Devin Verreck; et al. (IRPS, 2025)