A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. - Dhafer Abdulameer Shnawah; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin (Microelectron. Reliab., 2012)

Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. - Dhafer Abdulameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che (Microelectron. Reliab., 2012)

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. - Mohammad Hossein Mahdavifard; Mohd Faizul Mohd Sabri; Dhafer Abdulameer Shnawah; Suhana Mohd Said; Irfan Anjum Badruddin; S. Rozali (Microelectron. Reliab., 2015)