Automated solder joint inspection system using optical 3-D image detection. - Yukio Matsuyama; Toshifumi Honda; Hisae Yamamura; Hideaki Sasazawa; Mineo Nomoto; Takanori Ninomiya; Anton Schick; Ludwig Listl; Paul Köllensperger; Dieter Spriegel; Peter Mengel; Richard Schneider (WACV, 1996)