P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. - Dima Al Saleh; Yousef Safari; Fahad Rahman Amik; Boris Vaisband (SOCC, 2023)

Thermal Simulator for Advanced Packaging and Chiplet-Based Systems. - Yousef Safari; Adam Corbier; Dima Al Saleh; Fahad Rahman Amik; Boris Vaisband (IEEE Trans. Very Large Scale Integr. Syst., 2025)