Reliability challenges for copper interconnects. - Baozhen Li; Timothy D. Sullivan; Tom C. Lee; Dinesh Badami (Microelectron. Reliab., 2004)

Electromigration challenges for advanced on-chip Cu interconnects. - Baozhen Li; Cathryn Christiansen; Dinesh Badami; Chih-Chao Yang (Microelectron. Reliab., 2014)

A case study of electromigration reliability: From design point to system operations. - Baozhen Li; K. Paul Muller; James D. Warnock; Leon J. Sigal; Dinesh Badami (IRPS, 2015)