Nanomechanical properties of Ag solder bumps doped with Pd and Au. - Hua-Chiang Wen; Wu-Ching Chou; Shiuan Huei Lin; Don Son Jiang (Microelectron. Reliab., 2017)

Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders. - Hua-Chiang Wen; Wu-Ching Chou; Po-Chen Lin; Yeau-Ren Jeng; Chien-Chang Chen; Hung-Ming Chen; Don Son Jiang; Chun-Hu Cheng (Microelectron. Reliab., 2017)