Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. - Dong Gun Kam; Joungho Kim; Jiheon Yu; Ho Choi; Kicheol Bae; Choonheung Lee (IEEE Des. Test Comput., 2006)

A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications. - Alberto Valdes-Garcia; Sean T. Nicolson; Jie-Wei Lai; Arun Natarajan 001; Ping-Yu Chen; Scott K. Reynolds; Jing-Hong Conan Zhan; Dong Gun Kam; Duixian Liu; Brian A. Floyd (IEEE J. Solid State Circuits, 2010)

Single-element and phased-array transceiver chipsets for 60-ghz Gb/s communications. - Alberto Valdes-Garcia; Scott K. Reynolds; Arun Natarajan 001; Dong Gun Kam; Duixian Liu; Jie-Wei Lai; Yen-Lin Oscar Huang; Ping-Yu Chen; Ming-Da Tsai; Jing-Hong Conan Zhan; Sean Nicolson; Brian A. Floyd (IEEE Commun. Mag., 2011)

A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications. - Arun Natarajan 001; Scott K. Reynolds; Ming-Da Tsai; Sean T. Nicolson; Jing-Hong Conan Zhan; Dong Gun Kam; Duixian Liu; Yen-Lin Oscar Huang; Alberto Valdes-Garcia; Brian A. Floyd (IEEE J. Solid State Circuits, 2011)

Optimization of flip-chip transitions for 60-GHz packages. - Dong Gun Kam (IEICE Electron. Express, 2014)

RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices. - Hyun Ho Park; Dong Gun Kam; Young-Bae Park; Jiseong Kim; Jae-Deok Lim; Hark-Byeong Park; Eakhwan Song (EMC Compo, 2015)

Complex permittivity extraction from PCB stripline measurement using recessed probe launch. - Chulsoon Hwang; Woocheon Park; Dong Gun Kam (IEICE Electron. Express, 2015)

Edge plating for building large arrays and low-inductance board-to-board connection. - Junho Park; Dong Gun Kam (IEICE Electron. Express, 2018)