Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

Effective work-function control technique applicable to p-type FinFET high-k/metal gate devices. - Shimpei Yamaguchi; Zeynel Bayindir; Xiaoli He; Suresh Uppal; Purushothaman Srinivasan; Chloe Yong; Dongil Choi; Manoj Joshi; Hyuck Soo Yang; Owen Hu; Srikanth Samavedam; Dong Kyun Sohn (Microelectron. Reliab., 2017)

What is Killing Moore's Law? Challenges in Advanced FinFET Technology Integration. - Arkadiusz Malinowski; James Chen; Shiv Kumar Mishra; Srikanth Samavedam; Dong Kyun Sohn (MIXDES, 2019)