Reliability studies and design improvement of mirror image CSP assembly. - Dongji Xie; Sammy Yi (Microelectron. Reliab., 2002)

Materials characterization of the effect of mechanical bending on area array package interconnects. - Daniel T. Rooney; N. Todd Castello; Mike Cibulsky; Doug Abbott; Dongji Xie (Microelectron. Reliab., 2004)

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules. - Daniel T. Rooney; Louis Gullo; Dongji Xie; N. Todd Castello; Dongkai Shanguan (Microelectron. Reliab., 2007)