Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading. - Ping Yang; Dongjing Liu; Yanfang Zhao; Yunqing Tang; Huan Wang (IEEE Trans. Reliab., 2013)

WHU-NERCMS at TRECVID2014: Instance Search Task. - Mang Ye; Bingyue Huang; Lei Yao; Jian Qin; Jian Guan; Xiao Wang 029; Bo Luo; Zheng Wang 007; Dongjing Liu; Zhuosheng Zhang 004; Su Mao; Chao Liang 001 (TRECVID, 2014)

Experimental and numerical approach on junction temperature of high-power LED. - Dongjing Liu; Haiying Yang; Ping Yang (Microelectron. Reliab., 2014)

WHU-NERCMS at TRECVID2015: Instance Search Task. - Lei Yao; Mang Ye; Dongjing Liu; Rui Shao 002; Tao Liu; Jun Liu 036; Zheng Wang 007; Chao Liang 001 (TRECVID, 2015)

Effects of stress-loading test methods on the degradation of light-emitting diode modules. - Miao Cai; Dao-Guo Yang; Jianna Zheng; Jianlin Huang; Dongjing Liu; Jing Xiao 003; Ping Zhang; Guoqi Zhang; Xianping Chen (Microelectron. Reliab., 2016)

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. - Ning Yang 002; Dao-Guo Yang; Guoqi Zhang; Liangbiao Chen; Dongjing Liu; Miao Cai; Xuejun Fan (Sensors, 2018)