Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. - Daniel T. Rooney; DeePak Nager; David Geiger; Dongkai Shanguan (Microelectron. Reliab., 2005)

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules. - Daniel T. Rooney; Louis Gullo; Dongji Xie; N. Todd Castello; Dongkai Shanguan (Microelectron. Reliab., 2007)