Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. - Jongwoo Park 001; Jungpyo Hong; Miji Lee; Dongyoon Sun; Kyung Kang; Taesung Kim; Seungwon Kim; Sujin Kwon; Changkyu Joo; Sangsu Ha; Wooyeon Kim; Jongsu Ryu; et al. (IRPS, 2015)

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. - Younggeun Ji; Jeonghoon Kim; Jungin Kim; Miji Lee; Jaeheon Noh; Taeyoung Jeong; Juhyeon Shin; Junho Kim; Young Heo; Ung Cho; Hyun-Chul Sagong; Junekyun Park; et al. (IRPS, 2018)