Macroelectronics: Perspectives on Technology and Applications. - Robert H. Reuss; Babu Chalamala; Alina Moussessian; Michael G. Kane; Amrita Kumar; David C. Zhang; John A. Rogers; Miltos Hatalis; Dorota Temple; Garret Moddel; Blake J. Eliasson; Michael J. Estes; et al. (Proc. IEEE, 2005)

Fabrication of TSV-based silicon interposers. - Dean Malta; Erik Vick; Scott H. Goodwin; Christopher Gregory; Matthew Lueck; Alan Huffman; Dorota Temple (3DIC, 2010)

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. - Jason D. Reed; Scott H. Goodwin; Christopher Gregory; Dorota Temple (3DIC, 2010)

Vias-last process technology for thick 2.5D Si interposers. - Erik Vick; Scott H. Goodwin; Garry Cunnigham; Dorota Temple (3DIC, 2011)

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch. - Matthew Lueck; Chris W. Gregory; Dean Malta; Alan Huffman; John M. Lannon; Dorota Temple (3DIC, 2013)

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test. - Dorota S. Temple; Dean Malta; Erik P. Vick; Matthew R. Lueck; Scott H. Goodwin; Mark S. Muzilla; Christopher M. Masterjohn; Mark R. Skokan (3DIC, 2014)

Wafer-Level Vacuum Packaging of Smart Sensors. - Allan Hilton; Dorota S. Temple (Sensors, 2016)

Innovative practices on design & test for flexible hybrid electronics. - Tsung-Ching Jim Huang; Jason Marsh; Scott H. Goodwin; Dorota S. Temple (VTS, 2018)

Remote Crop Mapping at Scale: Using Satellite Imagery and UAV-Acquired Data as Ground Truth. - Meghan Hegarty-Craver; Jason Polly; Margaret O'Neil; Noel Ujeneza; James Rineer; Robert H. Beach; Daniel Lapidus; Dorota S. Temple (Remote. Sens., 2020)