Thin-film imaging: Past, present, prognosis. - David E. Seeger; Douglas C. La Tulipe Jr.; Roderick R. Kunz; Cesar M. Garza; Maureen A. Hanratty (IBM J. Res. Dev., 1997)

Three-dimensional integrated circuits. - Anna W. Topol; Douglas C. La Tulipe Jr.; Leathen Shi; David J. Frank; Kerry Bernstein; Steven E. Steen; Arvind Kumar; Gilbert U. Singco; Albert M. Young; Kathryn W. Guarini; Mei-Kei Ieong (IBM J. Res. Dev., 2006)

Wafer-level 3D integration technology. - Steven J. Koester; Albert M. Young; Roy R. Yu; Sampath Purushothaman; Kuan-Neng Chen; Douglas C. La Tulipe Jr.; Narender Rana; Leathen Shi; Matthew R. Wordeman; Edmund J. Sprogis (IBM J. Res. Dev., 2008)