3D stacking: Where the rubber meets the road. - Chandra Nimmagadda; Durodami Lisk; Riko Radojcic (ICICDT, 2012)

Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs. - Xiaoxia Wu; Wei Zhao; Mark Nakamoto; Chandra Nimmagadda; Durodami Lisk; Sam Gu; Riko Radojcic; Matt Nowak; Yuan Xie 001 (IEEE Trans. Very Large Scale Integr. Syst., 2012)

Power and signal integrity challenges in 3D systems. - Miguel Corbalan; Anup Keval; Thomas Toms; Durodami Lisk; Riko Radojcic; Matt Nowak (DAC, 2013)