Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. - Dwayne R. Shirley; Hamid R. Ghorbani; Jan K. Spelt (Microelectron. Reliab., 2008)

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. - Weishen Chu; Laura Spinella; Dwayne R. Shirley; Paul S. Ho (IRPS, 2020)

Chip Board Package Interaction Reliability for Large Size FCBGA Package. - Richard Rao; Sean Hsu; Ivan Tan; Steve Yang; Shrinath Ramdas; Dwayne R. Shirley; Kevin Caffey (IRPS, 2025)