Yield-driven minimum energy CMOS cell design. - Max A. Korbel; Dylan C. Stow; Chris R. Ferguson; David Money Harris (ACSCC, 2012)

Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. - Peng Gu; Shuangchen Li; Dylan C. Stow; Russell Barnes; Liu Liu 017; Yuan Xie 001; Eren Kursun (ACM Great Lakes Symposium on VLSI, 2016)

Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration. - Dylan C. Stow; Itir Akgun; Russell Barnes; Peng Gu; Yuan Xie 001 (ICCAD, 2016)

Thermal-aware 3D design for side-channel information leakage. - Peng Gu; Dylan C. Stow; Russell Barnes; Eren Kursun; Yuan Xie 001 (ICCD, 2016)

Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. - Dylan C. Stow; Itir Akgun; Russell Barnes; Peng Gu; Yuan Xie 001 (ISVLSI, 2016)

Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. - Jaya Dofe; Peng Gu; Dylan C. Stow; Qiaoyan Yu; Eren Kursun; Yuan Xie 001 (ACM Great Lakes Symposium on VLSI, 2017)

Cost-effective design of scalable high-performance systems using active and passive interposers. - Dylan C. Stow; Yuan Xie 001; Taniya Siddiqua; Gabriel H. Loh (ICCAD, 2017)

Cost-efficient 3D Integration to Hinder Reverse Engineering During and After Manufacturing. - Peng Gu; Dylan C. Stow; Prashansa Mukim; Shuangchen Li; Yuan Xie 001 (AsianHOST, 2018)

Die Stacking Is Happening. - Xing Hu 001; Dylan C. Stow; Yuan Xie 001 (IEEE Micro, 2018)

Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory. - Dylan C. Stow; Itir Akgun; Wenqin Huangfu; Yuan Xie 001; Xueqi Li 001; Gabriel H. Loh (DAC, 2019)

Investigation of Cost-Optimal Network-on-Chip for Passive and Active Interposer Systems. - Dylan C. Stow; Itir Akgun; Yuan Xie 001 (SLIP, 2019)

Power Profiling of Modern Die-Stacked Memory. - Dylan C. Stow; Amin Farmahini Farahani; Sudhanva Gurumurthi; Michael Ignatowski; Yuan Xie 001 (IEEE Comput. Archit. Lett., 2019)

Network-on-Chip Design Guidelines for Monolithic 3-D Integration. - Itir Akgun; Dylan C. Stow; Yuan Xie 001 (IEEE Micro, 2019)

Thermal-Aware 3D Design for Side-Channel Information Leakage. - Dylan C. Stow; Russell Barnes; Eren Kurshan; Yuan Xie 001 (CoRR, 2025)