Isothermal aging characteristics of Sn-Pb micro solder bumps. - Kyung-Seob Kim; C. H. Yu; Nam-Hoon Kim; N. K. Kim; H. J. Chang; E. G. Chang (Microelectron. Reliab., 2003)

Fatigue analysis of high-speed photodiode submodule by using FEM. - Kyung-Seob Kim; H. I. Kim; C. H. Yu; E. G. Chang (Microelectron. Reliab., 2004)