Time dependent dielectric breakdown in a low-k interlevel dielectric. - J. R. Lloyd; E. Liniger; S. T. Chen (Microelectron. Reliab., 2004)

Reliability Challenges with Ultra-Low k Interlevel Dielectrics. - J. R. Lloyd; M. R. Lane; X.-H. Liu; E. Liniger; T. M. Shaw; C.-K. Hu; R. Rosenberg (Microelectron. Reliab., 2004)

The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. - J. R. Lloyd; C. E. Murray; S. Ponoth; S. Cohen; E. Liniger (Microelectron. Reliab., 2006)