Percolative approach for failure time prediction of thin film interconnects under high current stress. - E. Misra; Md. M. Islam; Mahbub Hasan; H. C. Kim; T. L. Alford (Microelectron. Reliab., 2005)

Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress. - E. Misra; N. D. Theodore; J. W. Mayer; T. L. Alford (Microelectron. Reliab., 2006)