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Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Engineered SiC materials for power technologies. - Walter Schwarzenbach; S. Rouchier; G. Berre; R. Boulet; O. Ledoux; Enrica Cela; Alexis Drouin; A. Chapelle; S. Monnoye; H. Biard; K. Alassaad; L. Viravaux; et al. (ICICDT, 2022)