Towards high performance sub-10nm finW bulk FinFET technology. - Thomas Chiarella; Stefan Kubicek; E. Rosseel; Romain Ritzenthaler; Andriy Hikavyy; P. Eyben; An De Keersgieter; L.-Å. Ragnarsson; M.-S. Kim; S.-A. Chew; Tom Schram; S. Demuynck; et al. (ESSDERC, 2016)

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. - A. Vandooren; Liesbeth Witters; Jacopo Franco; Arindam Mallik; Bertrand Parvais; Z. Wu; Amey Walke; V. Deshpande; E. Rosseel; Andriy Hikavyy; W. Li; L. Peng; et al. (ICICDT, 2018)

Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections. - A. Vandooren; N. Parihar; Jacopo Franco; Roger Loo; Hiroaki Arimura; R. Rodriguez; F. Sebaai; S. Iacovo; Kevin Vandersmissen; W. Li; G. Mannaert; D. Radisic; et al. (VLSI Technology and Circuits, 2022)

Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails. - Anabela Veloso; Anne Jourdain; D. Radisic; Rongmei Chen; G. Arutchelvan; B. O'Sullivan; Hiroaki Arimura; Michele Stucchi; An De Keersgieter; M. Hosseini; T. Hopf; K. D'Have; et al. (VLSI Technology and Circuits, 2022)

Monolithic Complementary Field Effect Transistors (CFET) Demonstrated using Middle Dielectric Isolation and Stacked Contacts. - Steven Demuynck; Victor Vega-Gonzalez; C. Toledo de Carvalho Cavalcante; L. Petersen Barbosa Lima; K. Stiers; C. Sheng; A. Vandooren; M. Hosseini; X. Zhou; Hans Mertens; Thomas Chiarella; Jürgen Bömmels; et al. (VLSI Technology and Circuits, 2024)