Highly reliable TaOx ReRAM with centralized filament for 28-nm embedded application. - Yukio Hayakawa; Atsushi Himeno; Ryutaro Yasuhara; W. Boullart; E. Vecchio; T. Vandeweyer; T. Witters; D. Crotti; M. Jurczak; S. Fujii; S. Ito; Y. Kawashima; et al. (VLSIC, 2015)

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. - A. Vandooren; Liesbeth Witters; Jacopo Franco; Arindam Mallik; Bertrand Parvais; Z. Wu; Amey Walke; V. Deshpande; E. Rosseel; Andriy Hikavyy; W. Li; L. Peng; et al. (ICICDT, 2018)