Junction-level thermal extraction and simulation of 3DICs. - Samson Melamed; Thorlindur Thorolfsson; Adi Srinivasan; Edmund Cheng; Paul D. Franzon; William Rhett Davis (3DIC, 2009)

Temperature-Aware Architecture: Lessons and Opportunities. - Wei Huang 004; Malcolm Allen-Ware; John B. Carter; Mircea R. Stan; Edmund Cheng (IEEE Micro, 2011)