The evolution of build-up package technology and its design challenges. - Edmund D. Blackshear; Moises Cases; Erich Klink; Stephen R. Engle; Ronald S. Malfatt; Daniel N. deAraujo; Stefano Oggioni; Luke D. Lacroix; Jamil A. Wakil; Nam H. Pham; Gareth G. Hougham; David J. Russell (IBM J. Res. Dev., 2005)

CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. - Zhuo-Jie Wu; Manish Nayini; Charles Carey; Samantha Donovan; David Questad; Edmund D. Blackshear (IRPS, 2019)