Moisture absorption and diffusion characterisation of packaging materials–advanced treatment. - Ee-Hua Wong; Ranjan Rajoo (Microelectron. Reliab., 2003)

Thermo-mechanical finite element analysis in a multichip build up substrate based package design. - Xiaowu Zhang; Ee-Hua Wong; Charles Lee; Tai Chong Chai; Yiyi Ma; Poi-Siong Teo; D. Pinjala; Srinivasamurthy Sampath (Microelectron. Reliab., 2004)

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. - Xiaowu Zhang; Ee-Hua Wong; Ranjan Rajoo; Mahadevan K. Iyer; J. F. J. M. Caers; X. J. Zhao (Microelectron. Reliab., 2005)

New insights into board level drop impact. - Ee-Hua Wong; Yiu-Wing Mai (Microelectron. Reliab., 2006)

Correlation studies for component level ball impact shear test and board level drop test. - Ee-Hua Wong; Ranjan Rajoo; S. K. W. Seah; C. S. Selvanayagam; W. D. van Driel; J. F. J. M. Caers; X. J. Zhao; N. Owens; L. C. Tan; M. Leoni; P. L. Eu; Y.-S. Lai; et al. (Microelectron. Reliab., 2008)

A review of board level solder joints for mobile applications. - Ee-Hua Wong; S. K. W. Seah; V. P. W. Shim (Microelectron. Reliab., 2008)

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation. - Ee-Hua Wong; Yiu-Wing Mai (Microelectron. Reliab., 2009)

Advances in the drop-impact reliability of solder joints for mobile applications. - Ee-Hua Wong; S. K. W. Seah; W. D. van Driel; J. F. J. M. Caers; N. Owens; Y.-S. Lai (Microelectron. Reliab., 2009)

The fundamentals of thermal-mass diffusion analogy. - Ee-Hua Wong (Microelectron. Reliab., 2015)

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption. - Ee-Hua Wong; Jarrod Cook; M. Dreno; Dao-Long Chen; Yi-Shao Lai (Microelectron. Reliab., 2015)

Constitutive modeling of solder alloys for drop-impact applications. - Ee-Hua Wong; J. Chrisp; C. S. Selvanayagam; S. K. W. Seah (Microelectron. Reliab., 2016)

Creep fatigue models of solder joints: A critical review. - Ee-Hua Wong; W. D. van Driel; Abhijit Dasgupta 002; Michael G. Pecht (Microelectron. Reliab., 2016)

Moisture diffusion modeling - A critical review. - Ee-Hua Wong; S. B. Park (Microelectron. Reliab., 2016)

Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. - Ee-Hua Wong; Johan Liu (Microelectron. Reliab., 2017)