Reliability of 80 mum pitch flip chip attachment on flex. - Petteri Palm; Jarmo Määttänen; Aulis Tuominen; Eero Ristolainen (Microelectron. Reliab., 2001)

Impact of component placement in solder joint reliability. - T. Alander; S. Nurmi; Pekka Heino; Eero Ristolainen (Microelectron. Reliab., 2002)

Anisotropic conductive film flip chip joining using thin chips. - Erja Jokinen; Eero Ristolainen (Microelectron. Reliab., 2002)

Failure mechanisms of adhesive flip chip joints. - Anne Seppälä; T. Allinniemi; Eero Ristolainen (Microelectron. Reliab., 2002)

Evaluation Of Resonating Channel Transistor In SOI Wafer. - S. Myllymaki; Eero Ristolainen; Pekka Heino; A. Lehto; K. Varjonen (Int. J. Comput. Eng. Sci., 2003)

Thermal conduction at the nanoscale in some metals by MD. - Pekka Heino; Eero Ristolainen (Microelectron. J., 2003)

Strength of Ta-Si interfaces by molecular dynamics. - Pekka Heino; Eero Ristolainen (Microelectron. Reliab., 2003)

Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. - Laura Frisk; Anne Seppälä; Eero Ristolainen (Microelectron. Reliab., 2004)

The effect of solder paste composition on the reliability of SnAgCu joints. - S. Nurmi; J. Sundelin; Eero Ristolainen; T. Lepistö (Microelectron. Reliab., 2004)

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. - Anne Seppälä; Eero Ristolainen (Microelectron. Reliab., 2004)

Flip chip attachment on flexible LCP substrate using an ACF. - Laura Frisk; Eero Ristolainen (Microelectron. Reliab., 2005)

Balancing temperature dependence of on-wafer SOS inductors. - Päivi H. Karjalainen; Eero Ristolainen (Microelectron. Reliab., 2006)