System level signal and power integrity analysis methodology for system-in-package applications. - Rohan Mandrekar; Krishna Bharath; Krishna Srinivasan; Ege Engin; Madhavan Swaminathan (DAC, 2006)

Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages. - Krishna Srinivasan; P. Muthana; Rohan Mandrekar; Ege Engin; Jinwoo Choi; Madhavan Swaminathan (ISQED, 2006)

Computationally Efficient Power Integrity Simulation for System-on-Package Applications. - Krishna Bharath; Ege Engin; Madhavan Swaminathan; Kazuhide Uriu; Toru Yamada (DAC, 2007)

Placement and routing of RF embedded passive designs in LCP substrate. - Mohit Pathak; Souvik Mukherjee; Madhavan Swaminathan; Ege Engin; Sung Kyu Lim (ICCD, 2007)

Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method. - Ege Engin; Krishna Bharath; Madhavan Swaminathan (ISCAS, 2007)

Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM. - Krishna Bharath; Ege Engin; Madhavan Swaminathan (DAC, 2008)

Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects. - Ki Jin Han; Madhavan Swaminathan; Ege Engin (DAC, 2008)

Resource Allocation of eMBB and URLLC Traffic using Pre-emption Mechanism. - Ege Engin; Ibrahim Hökelek; Hakan Ali Çirpan (TSP, 2023)

A Pre-Emptive Scheduling Mechanism for Service Assurance of Network Slicing in Next Generation Cellular Networks. - Ege Engin; Ibrahim Hökelek; Ali Gorcin; Hakan A. Çirpan (IEEE Access, 2025)