Virtual Enterprise Architecture and its Supporting Methods/Tools for Managing Support Chain System Life Cycle. - Yoichi Kamio; Eiichi Yamamoto; Kazuo Morita; Yoshiro Fukuda; Yasuyuki Nishioka (DIISM, 2000)

Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal. - Naoya Watanabe; Masahiro Aoyagi; Daisuke Katagawa; Tsubasa Bandoh; Takahiko Mitsui; Eiichi Yamamoto (3DIC, 2014)