Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. - Elaheh Arjmand; Pearl A. Agyakwa; C. Mark Johnson (Microelectron. Reliab., 2014)

A thermal cycling reliability study of ultrasonically bonded copper wires. - Elaheh Arjmand; Pearl A. Agyakwa; Martin R. Corfield; Jianfeng Li 002; Bassem Mouawad; C. Mark Johnson (Microelectron. Reliab., 2016)