Stress analyses of high spatial resolution on TSV and BEoL structures. - Dietmar Vogel; Ellen Auerswald; Jürgen Auersperg; Parisa Bayat; Raul D. Rodriguez; Dietrich R. T. Zahn; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2014)

Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments. - Dietmar Vogel; Ellen Auerswald; Gh. Gadhiya; Sven Rzepka (Microelectron. Reliab., 2016)

Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. - Jürgen Auersperg; Ellen Auerswald; Christian Collet; Thierry Dean; Dietmar Vogel; Thomas Winkler; Sven Rzepka (Microelectron. Reliab., 2018)