Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. - Kenny C. Otiaba; Ndy N. Ekere; R. S. Bhatti; Sabuj Mallik; M. O. Alam; Emeka H. Amalu (Microelectron. Reliab., 2011)

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. - Emeka H. Amalu; Ndy N. Ekere (Microelectron. Reliab., 2012)

High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. - Emeka H. Amalu; Ndy N. Ekere (Microelectron. Reliab., 2012)

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. - Kenny C. Otiaba; R. S. Bhatti; Ndy N. Ekere; Sabuj Mallik; M. O. Alam; Emeka H. Amalu; Mathias Ekpu (Microelectron. Reliab., 2012)

Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly. - M. T. Zarmai; Ndy N. Ekere; C. F. Oduoza; Emeka H. Amalu (Microelectron. Reliab., 2016)